讲座主题：Power Conversion and System Packaging Technologies with SiC power semiconductor devices for Harsh Environment Applications

讲座人：Dr. Saijun Mao, Fudan University

讲座摘要：

This tutorial will focus on the power conversion and system packaging technologies with silicon carbide (SiC) power semiconductor devices for downhole and subsea power high temperature high pressure harsh environment applications. The downhole oil well logging tools need to operate up to several kilometers deep-well, which accounts for 30kpsi extreme pressure and high temperatures of 150°C to 175°C and beyond. The subsea oil exploration electrical systems need to be located at depths of up to 3km in deep water and to withstand high pressure around 4.4kpsi (300bar). Because of the downhole and subsea harsh-environment applications, the power conversion systems need to survive well beyond the traditional temperature, high pressure, as well as high shock and vibration environments. The challenges of high temperature, high pressure environments bring the research and development opportunities for power generation, power conversion and power electronics packaging technologies to meet the requirements of oil & gas downhole and subsea industry. This tutorial aims at providing power electronics researchers and engineers with fundamental knowledge (mainly for entry-level professionals) as well as advanced design techniques (mainly for senior-level professionals) of power conversion and packaging technologies. The tutorial will start with the overview of oil & gas downhole power generation and conversion system, as well as subsea power system. The key requirements for the high temperature high pressure harsh environment power generation & conversion and system packaging technologies will be introduced. The tutorial will then introduce the high temperature power generation with the turbine generator as the downhole energy harvester and power conversion with SiC power semiconductor devices. The high temperature packaging and switching characterizations of 1.2 kV SiC MOSFETs, as well as high temperature gate driver circuit solution at 175°C will be presented. The high pressure subsea power packaging technologies for pressure tolerant power electronics considering the mechanical, electrical, thermal and reliability requirements will be provided. The reliably, power density and packaging technologies, as well as characterizations of SiC MOSFET modules for subsea medium voltage drive inverters will be discussed. The detailed insulation and thermal modeling, packaging design and experimental validation for the subsea pressure tolerant 60 kVDC/1.5 kA oil insulated high voltage switches and 5 MVA 22 kV/6.6 kV subsea power transformers will be introduced in details. The last section of the tutorial will provide a summary and development trends of power conversion and system packaging technologies high temperature high pressure harsh environment applications.
- Outline:
1) Introduction: 
-Overview of downhole and subsea harsh-environment power conversion systems
-Introduction of the state-of-the-art downhole power conversion & system packaging technologies
-Introduction of the state-of-the-art subsea power conversion & system packaging technologies
-Challenges of power conversion & system packaging technologies for high temperature high pressure harsh environment
-Key enabling technologies for high temperature high pressure harsh environment applications
2) Downhole power generation and conversion with SiC power semiconductor devices:
-High temperature power generation with the turbine generator as the downhole energy harvester
-Characterization and prototype experiment results of turbine generator based downhole power generation
-High temperature power conversion system with SiC power semiconductor devices
-High temperature switching characterizations of 1.2kV SiC MOSFETs
-Circuit modeling of high temperature 1.2kV SiC MOSFETs
-High temperature gate driver circuit design and prototype experimental results
-High temperature start-up Flyback power supply design and prototype experimental results
-High temperature EMI filter solutions
-High pressure packaging solutions for downhole power system
3) Subsea high pressure power packaging:
-Analysis of high pressure power packaging technologies for subsea pressure tolerant power electronics
-Analysis of the reliably and power density for subsea medium voltage drive inverters
-Packaging technologies of subsea medium voltage drive inverters
-Characterizations of SiC MOSFET modules for subsea medium voltage drive inverters
-Thermal modeling, packaging design and experimental validation for the subsea pressure tolerant 60kVDC/1.5kA oil insulated high voltage switches
-Insulation and thermal modeling, packaging design and experimental validation for 5 MVA 22kV/6.6 kV subsea power transformers
4) Summary:
-Summary of downhole and subsea high temperature high pressure harsh-environment power conversion and system packaging technologies
-Development trends of harsh environment power conversion and system packaging technologies

讲座人介绍：

Astronautics, Nanjing, China, the Ph.D. degree from Delft University of Technology, Delft, the Netherlands, all in electrical engineering. From 2006 to 2017, he was a senior engineer and project leader with the GE Global Research Center, Shanghai, China. He was also with the Electrical Power Processing group in the department of Electrical Sustainable Energy at the Delft University of Technology, Delft, the Netherlands as a Ph.D. Researcher since December 2014. He was the Vice President of Shanghai Lingang Power Electronics Research Institute, and Principal Engineer in Leadrive Technology (Shanghai) Co., Ltd. He is now a Research Fellow in the Center for Shanghai Silicon Carbide Power Devices Engineering & Technology Research, Fudan University, China. His research interests include wide-bandgap power semiconductor devices-based power conversion systems, high frequency high voltage generator systems, as well as harsh environment power conversion and packaging. He has published more than 40 conference and journal papers. Dr. Mao has provided 4 tutorials in IEEE APEC and ECCE conferences. He holds over 40 issued patents and pending patent applications. He received one IEEE Best Paper award. He received more than 15 awards, including annual technology excellence award, annual technology excellence team award and top inventor award in GE Global Research Center.