Harufusa Kondo 博士
Mitsubishi Electric Corp. Power Device Works
Senior Technical Advisor
报告题目：Advancement of Power chip and module technology

报告摘要：Mitsubishi Electric Corp. has long experience of innovative power devices. This speech will cover brief history and latest advancement of our power devices, which includes Si-IGBT and SiC chip technology. It also describes power devices for such application as industry, railway/power, white goods, and automotive.

报告人简介：Harufusa Kondo received the B.S., M.S., and Ph.D. degrees from Osaka University, JAPAN.  In 1985, he joined the LSI R&D Laboratory, Mitsubishi Electric Corporation, where he had been engaged in the design of system VLSI’s for digital communication. In 2003, he moved to the Optical and High-frequency Device Works as a manager of Optical Transceiver. Since 2009, he has been working at Power Device Works for the development of DIPIPM™, Industrial IGBT modules, and high-voltage modules for railway application including SiC.  He is currently the Senior Technical Advisor at Power Device Works, Mitsubishi Electric Corporation.